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Sanfan Chemical
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Sanfan Chemical

Leading Manufacturer and Supplier of MQ Silicone Resins, Organopolysilazane Resins, Silanes&Silazanes, Silicone Fluids, MS Polymers and customized chemical solutions. We connect innovation with industrial performance.

  • No.818 Geguan Road, Jiangbei New District, Nanjing, Jiangsu Province, China
  • inquiry@sanfanchem.com
  • +86 025 58894227

빠른 링크

  • 홈
  • 제품
  • 응용 분야
  • 블로그
  • 회사 소개
  • 연락처

주요 제품

  • Polysilazane Resins
  • MQ Silicone Resins
  • Phenyl Silicone Resins
  • Siloxanes & Silazanes
  • Silanes
  • Silicone Oils
  • Others

최근 블로그

  • 유기 폴리실라잔 수지의 특성
  • Classification of Polysilazanes (PSZ)
  • Organo-polysilazanes countries of applications
  • MQ Resin Molecular Weight Influence
  • Different Viscosity Epoxy Silane Oligomer

© 2026 Sanfan Chemical. 모든 권리 보유.

개인정보 보호정책서비스 약관사이트맵
  1. 홈
  2. 응용 분야
  3. Electronics Materials

응용 분야

Electronics Materials

Materials for electronics: fluorinated coatings for circuit boards, silanes for epoxy encapsulants and PCBs, photoresist adhesion promoters and CVD precursors, and silicone fluids for potting and dielectric use.

Printed circuit boards and electronic components

Electronics ask for materials that insulate, protect and stay stable for years in a small space that gets hot. Silicon chemistry appears at almost every stage: in the wafer fab as adhesion promoters and deposition precursors, in packaging as coupling agents for epoxy encapsulants, and on the finished board as protective coatings and silicone potting.

Protective coatings for boards and components

Fluorosilane coatings form a film only a few micrometres thick — or a single molecule thick — that repels water, oil and corrosive gases without affecting electrical contact. They are applied by dipping or spraying to circuit board assemblies, connectors and sensors.

Encapsulants and circuit boards

Epoxy encapsulants, sealants and laminates are filled with silica and glass. Epoxy silanes bond that filler into the resin, which improves strength and, more importantly, keeps the electrical properties from degrading when moisture reaches the interface.

Wafer processing

Hexamethyldisilazane primes wafers so photoresist adheres, and tetramethyldivinyldisilazane serves as a tackifier for negative photoresists. High-purity tetraethyl orthosilicate is a precursor for silicon dioxide films by chemical vapour deposition. Methacryloxypropyl POSS is used in UV-curable and photoresist formulations for fine circuitry.

Potting, gels and dielectric fluids

Silicone potting compounds and gels protect components from moisture, vibration and heat. Hydroxyl-terminated fluids are the base of condensation-cure potting; vinyl fluids and electronic-grade methylhydrogen fluids are the base and crosslinker of addition-cure systems, including thermally conductive grades. Silicone and phenyl silicone fluids serve as dielectric fluids in capacitors and transformers, and silicone resin powders diffuse light in LED covers.

What to check

  • Purity and ionic content, for anything that touches a wafer or a live circuit.
  • Low-molecular-weight siloxanes, which can migrate and contaminate contacts; low-cyclic grades are chosen for electronics.
  • Cure by-products, which should not corrode copper or silver.

For a recommendation for your formulation, a COA, an SDS or a quotation, contact our technical sales team.

관련 제품

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Others

SF-C420 Electronic Grade Coating

fluoro-Electronic-Grade-Coating

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Silanes

SF-S903 1H,1H,2H,2H-Perfluorodecyltrimethoxysilane

CAS 83048-65-1

1H,1H,2H,2H-Perfluorodecyltrimethoxysilane; 1H,1H,2H,2H-Heptadecafluorodecyltrimethoxysilane CAS No. 83048-65-1

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Silanes

SF-S1861 2-(3,4-Epoxycyclohexyl)ethyltriethoxysilane

CAS 10217-34-2

2-(3,4-Epoxycyclohexyl)ethyltriethoxysilane CAS No. 10217-34-2

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Silanes

SF-S560 3-Glycidoxypropyl(trimethoxysilane)

CAS 2530-83-8

γ-(2,3-epoxypropoxy)propyltrimethoxysilane; 3-(2,3-epoxypropoxy)propyltrimethoxysilane; 3-Glycidoxypropyl(trimethoxysilane) CAS No. 2530-83-8

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Siloxanes & Silazanes

SF-SN62 Hexamethyldisilazane

CAS 999-97-3

Hexamethyldisilazane; 1,1,1,3,3,3-hexamethyldisilazane; HMDS CAS No. 999-97-3

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Siloxanes & Silazanes

SF-SN42 Tetramethyldivinyldisilazane

CAS 7691-02-3

1,3-Divinyl-1,1,3,3-tetramethyldisilazane; Tetramethyldivinyldisilazane (VMN) CAS No. 7691-02-3

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Silanes

SF-S028 Tetraethylsilicate, TEOS

CAS 78-10-4

Tetraethyl orthosilicate; Tetraethoxysilane; Tetraethylsilicate; TEOS CAS No. 78-10-4

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MQ Silicone Resins

SF-POSS240 Methacryloxypropyl POSS

CAS 160185-24-0

Nanoscale cage-like polyhedral oligomeric silsesquioxane

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Silicone Oils

SF-LH201 Hydrogen silicone oil

low-cyclic electronic-grade methylhydrosiloxane oil (dimethylmethylhydrosiloxane copolymer)

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Silicone Oils

SF-QT200 OH end-blocked polydimethylsiloxane

CAS 70131-67-8

Silanol fluid; silicone fluid; OH end-blocked polydimethylsiloxane; 107 polymer; Hydroxy silicone oil CAS No. 70131-67-8

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Silicone Oils

SF-MV200 Mono terminated vinyl silicone oil

CAS 68952-00-1, 68951-99-5

Single end-capped vinyl silicone oil; Mono terminated vinyl silicone oil; vinyl silicone fluid

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MQ Silicone Resins

SF-152 Spherical silicone resin

CAS 68554-70-1

Polymethylsilsesquioxane (spherical silicone resin) micro powder is a kind of polymethylsilsesquioxane produced by hydrolysis and polymerization of organosilicone as raw material. It is a spherical micron-sized silicone resin powder, also known as silicone microspheres.

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